![[Data] Shirutoku Report No. 31 # Thermal Stress Caused by Thermal Expansion and Contraction](https://image.mono.ipros.com/public/product/image/4bb/2000690832/IPROS41882010557157872661.jpeg?w=280&h=280)
[Data] Shirutoku Report No. 31 # Thermal Stress Caused by Thermal Expansion and Contraction
The thermal stress caused by temperature changes is greater than expected! It is important to consider expansion and contraction in the design.
★★Shirutoku Report: Useful Information You Can Benefit From★★ In daily life, we don't often think about it, but when the temperature of an object changes, thermal expansion and contraction occur. The magnitude of this expansion and contraction varies depending on the properties of each material (coefficient of linear expansion). In this report, we will discuss the thermal stress caused by this thermal expansion and contraction. For more details, please take a moment to read it. 【Contents】 ■ Simple thermal warping calculation tool for laminated boards *For more information, please refer to the PDF document or feel free to contact us.*
- 企業：Wave Technology
- 価格：Other
